Invention Grant
US09331272B2 3-dimensional (3D) non-volatile memory device and method of fabricating the same
有权
3维(3D)非易失性存储器件及其制造方法
- Patent Title: 3-dimensional (3D) non-volatile memory device and method of fabricating the same
- Patent Title (中): 3维(3D)非易失性存储器件及其制造方法
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Application No.: US14125198Application Date: 2012-06-11
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Publication No.: US09331272B2Publication Date: 2016-05-03
- Inventor: Cheol Seong Hwang , Jun Yeong Seok
- Applicant: Cheol Seong Hwang , Jun Yeong Seok
- Applicant Address: KR Seoul
- Assignee: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
- Current Assignee: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
- Current Assignee Address: KR Seoul
- Agency: Ladas & Parry LLP
- Priority: KR10-2011-0056207 20110610; KR10-2011-0061665 20110624
- International Application: PCT/KR2012/004582 WO 20120611
- International Announcement: WO2012/169850 WO 20121213
- Main IPC: H01L29/02
- IPC: H01L29/02 ; H01L45/00 ; H01L27/06 ; H01L27/10 ; H01L27/24 ; H01L43/02 ; H01L43/12 ; H01L27/22

Abstract:
Provided are 3D non-volatile memory devices and methods of fabricating the same. A 3D non-volatile memory device according to an embodiment of the present invention includes a plurality of conductive lines, which are separated from one another in parallel; a plurality of conductive planes, which extend across the plurality of conductive lines and are separated from one another in parallel; and non-volatile data storage layer patterns, which are respectively arranged at regions of intersection at which the plurality of conductive lines and the plurality of conductive planes cross each others.
Public/Granted literature
- US20140124729A1 3-DIMENSIONAL (3D) NON-VOLATILE MEMORY DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2014-05-08
Information query
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