Invention Grant
- Patent Title: Terminal-fitted wire manufacturing method
- Patent Title (中): 端子配线生产方法
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Application No.: US13813724Application Date: 2011-07-28
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Publication No.: US09331399B2Publication Date: 2016-05-03
- Inventor: Akira Itou , Kouichirou Goto
- Applicant: Akira Itou , Kouichirou Goto
- Applicant Address: JP Yokkaichi
- Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee Address: JP Yokkaichi
- Agent Gerald E. Hespos; Michael J. Porco; Matthew T. Hespos
- Priority: JP2010-216728 20100928
- International Application: PCT/JP2011/067214 WO 20110728
- International Announcement: WO2012/043049 WO 20120405
- Main IPC: H01R43/00
- IPC: H01R43/00 ; H01R3/00 ; H01R43/05 ; H01R4/72 ; H01R4/18

Abstract:
It is aimed to enable a heat shrinkable tube to be mounted on a connected part of a core exposed portion of a wire and a terminal with high positioning accuracy. A terminal-fitted wire manufacturing method is for mounting a heat shrinkable tube on a connected part of a core exposed portion of a wire and a terminal. After the wire is inserted into the heat shrinkable tube, the terminal is connected to the core exposed portion. Thereafter, the heat shrinkable tube is moved to a position for covering the connected part of the core exposed portion and the terminal, and a part of the heat shrinkable tube is temporarily fixed to at least parts of the wire and the terminal. Thereafter, the heat shrinkable tube is mounted by being heated and thermally shrunk.
Public/Granted literature
- US20130175088A1 TERMINAL-FITTED WIRE MANUFACTURING METHOD AND TERMINAL-FITTED WIRE Public/Granted day:2013-07-11
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