Invention Grant
US09331668B2 Vibrator with a beam-shaped portion above a recess in a substrate, and oscillator using same
有权
在衬底中的凹部上方具有梁状部分的振动器,以及使用其的振荡器
- Patent Title: Vibrator with a beam-shaped portion above a recess in a substrate, and oscillator using same
- Patent Title (中): 在衬底中的凹部上方具有梁状部分的振动器,以及使用其的振荡器
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Application No.: US14218053Application Date: 2014-03-18
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Publication No.: US09331668B2Publication Date: 2016-05-03
- Inventor: Takahiko Yoshizawa
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2013-066958 20130327
- Main IPC: H03H9/24
- IPC: H03H9/24 ; H03H9/17 ; H03H9/02 ; H03B5/30 ; H03B5/02 ; H03H3/02

Abstract:
A method for manufacturing a vibrator according to the present invention includes: forming a coating layer that covers a silicon substrate; patterning the coating layer; forming a semiconductor layer that covers the silicon substrate and the coating layer; forming a vibrating portion having a beam shape on the coating layer and a support portion that supports the vibrating portion by patterning the semiconductor layer; forming an opening that exposes the silicon substrate; forming a recess portion by removing the silicon substrate through the opening; and removing the coating layer. In the step of forming the vibrating portion and the support portion, the support portion having a first portion that is located on the silicon substrate, and a second portion that connects the first portion and the vibrating portion and is located on the coating layer is formed.
Public/Granted literature
- US20140292427A1 METHOD FOR MANUFACTURING A VIBRATOR, VIBRATOR, AND OSCILLATOR Public/Granted day:2014-10-02
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