Invention Grant
US09331673B2 Integrated circuit operating active circuitry and chip pads in different operating modes and at different voltage levels
有权
集成电路在不同的工作模式和不同的电压电平下工作有源电路和芯片焊盘
- Patent Title: Integrated circuit operating active circuitry and chip pads in different operating modes and at different voltage levels
- Patent Title (中): 集成电路在不同的工作模式和不同的电压电平下工作有源电路和芯片焊盘
-
Application No.: US14144759Application Date: 2013-12-31
-
Publication No.: US09331673B2Publication Date: 2016-05-03
- Inventor: Peter Andrew Rees Williams , Barnaby Golder
- Applicant: QUALCOMM TECHNOLOGIES INTERNATIONAL, LTD.
- Applicant Address: GB Cambridge
- Assignee: Qualcomm Technologies International, Ltd.
- Current Assignee: Qualcomm Technologies International, Ltd.
- Current Assignee Address: GB Cambridge
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Main IPC: H03K3/012
- IPC: H03K3/012 ; H03K19/0175 ; H03K3/037
Abstract:
An integrated circuit having an external connection pad and an active circuit for generating signals to be output from the integrated circuit by means of the pad, the integrated circuit including an interface circuit associated with the pad, the interface circuit including a latch coupled between the pad and an output of the active circuit, the latch being capable of operating in a first mode in which the state of the pad follows the state of the output of the active circuit and a second mode in which the state of the pad is held by the latch.
Public/Granted literature
- US20150188517A1 CHIP PADS Public/Granted day:2015-07-02
Information query
