Invention Grant
- Patent Title: Molded semiconductor package with snap lid
- Patent Title (中): 带卡扣盖的模制半导体封装
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Application No.: US13837283Application Date: 2013-03-15
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Publication No.: US09332164B2Publication Date: 2016-05-03
- Inventor: Steven Webster
- Applicant: Amkor Technology, Inc.
- Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee: AMKOR TECHNOLOGY, INC.
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H04N5/225
- IPC: H04N5/225 ; G02B7/02 ; H01L27/146 ; H01L31/0203 ; H01L31/0232 ; H01L23/00

Abstract:
An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.
Public/Granted literature
- US20130265486A1 MOLDED IMAGE SENSOR PACKAGE HAVING LENS HOLDER Public/Granted day:2013-10-10
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