The present invention provides a technology related to an improvement in the performance of releasing heat generated in a semiconductor light-emitting device. In a light-emitting module including a semiconductor light-emitting device provided with at least a semiconductor light-emitting element and a phosphor, and a circuit board, on the circuit board, at least a semiconductor light-emitting device including a plurality of semiconductor light-emitting elements each having a different path of a drive current to be supplied thereto, or a plurality of semiconductor light-emitting devices each having a different path of a drive current to be supplied to the semiconductor light-emitting elements is mounted. The circuit board is provided with a base material portion formed using a heat-conducting material, and a power supply conductor layer for supplying the drive currents of the semiconductor light-emitting elements to the semiconductor light-emitting device. The power supply conductor layer is planarly formed using a heat-conducting material, so as to cover a planar surface of the base material portion, and the planar region of the power supply conductor layer is planarly divided by an insulator for each drive current path.