Invention Grant
- Patent Title: Etching method
- Patent Title (中): 蚀刻方法
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Application No.: US14436475Application Date: 2013-10-09
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Publication No.: US09332647B2Publication Date: 2016-05-03
- Inventor: Norikazu Nakamura
- Applicant: MIMAKI ENGINEERING CO., LTD.
- Applicant Address: JP Nagano
- Assignee: MIMAKI ENGINEERING CO., LTD.
- Current Assignee: MIMAKI ENGINEERING CO., LTD.
- Current Assignee Address: JP Nagano
- Agency: Jiang Chyun Intellectual Property Office
- Priority: JP2012-232130 20121019
- International Application: PCT/JP2013/077448 WO 20131009
- International Announcement: WO2014/061522 WO 20140424
- Main IPC: B44C1/22
- IPC: B44C1/22 ; H05K3/06 ; H05K3/00 ; G03F7/00

Abstract:
A solution is characteristic in being an etching method that processes a surface of a target object by corroding the surface by a corrosive, and the etching method includes: a resist forming step of forming a resist on the surface using resist liquid by ink jet printing the resist liquid on the surface; a surface corroding step of corroding a portion of the surface where the resist is not formed by bringing the corrosive into contact with a surface side of the target object where the resist has been formed in the resist forming step; and a resist detaching step of detaching the resist from the surface after the surface corroding step, wherein the resist forming step is a step of forming the resist by the resist liquid containing monofunctional monomers or monofunctional oligomers, and polyfunctional monomers or polyfunctional oligomers.
Public/Granted literature
- US20150305165A1 ETCHING METHOD Public/Granted day:2015-10-22
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