Invention Grant
- Patent Title: Flexible printed circuit board for packaging semiconductor device and method of producing the same
- Patent Title (中): 用于包装半导体器件的柔性印刷电路板及其制造方法
-
Application No.: US14066905Application Date: 2013-10-30
-
Publication No.: US09332649B2Publication Date: 2016-05-03
- Inventor: DoYoung Kim , KyungDuk Kim
- Applicant: Magnachip Semiconductor, Ltd.
- Applicant Address: KR Cheongju-si
- Assignee: Magnachip Semiconductor, Ltd.
- Current Assignee: Magnachip Semiconductor, Ltd.
- Current Assignee Address: KR Cheongju-si
- Agency: NSIP Law
- Priority: KR10-2012-0128367 20121113
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H05K3/10 ; H01L23/498 ; H01L23/552 ; H05K1/02 ; H05K1/18
Abstract:
A flexible circuit board, a semiconductor package, and methods of forming the same are provided. The flexible circuit board includes: a base film; an input line pattern, an output line pattern, and a dummy pattern on a first surface of the base film; and a ground pattern on a second surface of the base film and electrically connected with the dummy pattern.
Public/Granted literature
- US20140131889A1 FLEXIBLE PRINTED CIRCUIT BOARD FOR PACKAGING SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME Public/Granted day:2014-05-15
Information query
IPC分类:
