Invention Grant
US09332652B2 Process for etching a recessed structure filled with tin or a tin alloy
有权
用于蚀刻填充有锡或锡合金的凹陷结构的工艺
- Patent Title: Process for etching a recessed structure filled with tin or a tin alloy
- Patent Title (中): 用于蚀刻填充有锡或锡合金的凹陷结构的工艺
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Application No.: US13979914Application Date: 2012-02-09
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Publication No.: US09332652B2Publication Date: 2016-05-03
- Inventor: Neal Wood , Dirk Tews
- Applicant: Neal Wood , Dirk Tews
- Applicant Address: DE Berlin
- Assignee: Atotech Deutschland GmbH
- Current Assignee: Atotech Deutschland GmbH
- Current Assignee Address: DE Berlin
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: EP11159179 20110322
- International Application: PCT/EP2012/052181 WO 20120209
- International Announcement: WO2012/126672 WO 20120927
- Main IPC: C23G1/02
- IPC: C23G1/02 ; H05K3/26 ; C23F1/40 ; H01L21/321 ; H01L21/3213 ; H05K3/34 ; H01L21/768
Abstract:
A process for etching excess tin or tin alloy deposits including the steps of providing a substrate having recessed structures filled with tin or a tin alloy and an excess layer of tin or tin alloy, providing an aqueous etching solution consisting of a source of hydroxide ions and a nitro-substituted aromatic sulfonic acid and having a pH value greater than 7, and contacting said substrate with said aqueous etching solution for removing said excess tin or tin alloy layer on top of the recessed structures filled with tin or a tin alloy.
Public/Granted literature
- US20140000650A1 PROCESS FOR ETCHING A RECESSED STRUCTURE FILLED WITH TIN OR A TIN ALLOY Public/Granted day:2014-01-02
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