Invention Grant
- Patent Title: Resin composition for insulating film, and use thereof
- Patent Title (中): 绝缘膜用树脂组合物及其用途
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Application No.: US14374444Application Date: 2012-12-19
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Publication No.: US09332653B2Publication Date: 2016-05-03
- Inventor: Yoshihide Sekito
- Applicant: KANEKA CORPORATION
- Applicant Address: JP Osaka
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Kagan Binder, PLLC
- Priority: JP2012-013338 20120125; JP2012-089521 20120410
- International Application: PCT/JP2012/082874 WO 20121219
- International Announcement: WO2013/111478 WO 20130801
- Main IPC: B32B3/02
- IPC: B32B3/02 ; H05K3/28 ; C08J5/18 ; C08K5/5313 ; C08G18/75 ; C08G18/79 ; C08G18/44 ; C08G18/00 ; C08L75/04 ; C08G18/66 ; C08G18/81 ; C08G18/08 ; C09D175/06 ; H05K1/03 ; H05K3/34
Abstract:
The present invention provides a resin composition for an insulating film which resin composition is excellent in tack property after drying and allows a resultant insulating film to be excellent in flexibility and electrical insulation reliability and to be small in warpage after curing, a resin film for an insulating film, an insulating film, and a printed wiring board provided with an insulating film. The resin composition for an insulating film contains at least: a (A) binder polymer; and (B) cross-linked polymer particles, whose polymer has a urethane bond and a carbonate skeleton in its molecule.
Public/Granted literature
- US20140363639A1 NOVEL RESIN COMPOSITION FOR INSULATING FILM, AND USE THEREOF Public/Granted day:2014-12-11
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