Invention Grant
- Patent Title: Electronic component case and electronic component device
- Patent Title (中): 电子元器件和电子元器件
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Application No.: US14477156Application Date: 2014-09-04
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Publication No.: US09332659B2Publication Date: 2016-05-03
- Inventor: Minshong Tan , Syuzo Aoki , Takuya Oda
- Applicant: Shinko Electric Industries Co., Ltd.
- Applicant Address: JP Nagano-shi
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano-shi
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2013-201828 20130927
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
An electronic component case includes a lower case including a bottom plate, a aide wall having a protruding portion, an engaging projection formed on an outer face of the side wall, and a screw hole formed in the side wall in a region where the protruding portion is provided, and an upper case including a top plate, a side wall in which an engaging hole is formed, and a notched hole forced in the side wall on the top plate side. The protruding portion of the lower case is engaged to the notched hole of the upper case, and the screw hole is exposed in the notched hole. The engaging projection of the lower case is engaged in the engaging hole of the upper case.
Public/Granted literature
- US20150092337A1 ELECTRONIC COMPONENT CASE AND ELECTRONIC COMPONENT DEVICE Public/Granted day:2015-04-02
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