Invention Grant
- Patent Title: Data center module with leveling pad
- Patent Title (中): 带调平垫的数据中心模块
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Application No.: US13682641Application Date: 2012-11-20
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Publication No.: US09332670B1Publication Date: 2016-05-03
- Inventor: John William Eichelberg
- Applicant: Amazon Technologies, Inc.
- Applicant Address: US NV Reno
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US NV Reno
- Agency: Meyertons, Hood, Kivlin, Kowert & Goetzel, P.C.
- Agent Robert C. Kowert
- Main IPC: H05K7/14
- IPC: H05K7/14 ; F16M9/00 ; G06F1/16

Abstract:
A system includes a floor, one or more modules, one or more pads between a base of the modules and the floor, and one or more pad compression mechanisms. The data center modules include more electrical systems coupled to the module base. The pads compress to conform to variations in the surface of the floor. The pad compression mechanisms are operable by a user to compress the pads between the modules and the floor.
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