Invention Grant
US09332670B1 Data center module with leveling pad 有权
带调平垫的数据中心模块

Data center module with leveling pad
Abstract:
A system includes a floor, one or more modules, one or more pads between a base of the modules and the floor, and one or more pad compression mechanisms. The data center modules include more electrical systems coupled to the module base. The pads compress to conform to variations in the surface of the floor. The pad compression mechanisms are operable by a user to compress the pads between the modules and the floor.
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