Invention Grant
- Patent Title: Heat dissipation of power electronics of a cooling unit
- Patent Title (中): 冷却单元电力电子设备的散热
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Application No.: US13863014Application Date: 2013-04-15
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Publication No.: US09332671B2Publication Date: 2016-05-03
- Inventor: Jens Schult , Torsten Trümper
- Applicant: AIRBUS OPERATIONS GMBH
- Applicant Address: DE Hamburg
- Assignee: AIRBUS OPERATIONS GMBH
- Current Assignee: AIRBUS OPERATIONS GMBH
- Current Assignee Address: DE Hamburg
- Agency: Dickinson Wright PLLC
- Priority: EP10164452 20120417
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K5/00 ; H05K7/20 ; F25D3/12 ; F25B7/00 ; F25B49/00 ; F28D15/00 ; F25B31/00 ; B64D13/00 ; B64D13/06

Abstract:
A cooling unit in a transport unit includes power electronics; a heat exchanger for thermally coupling a cooling agent of a central cooling system of the transport unit with air of the cooling unit to cool one or more generating devices; and a heat pipe for heat dissipation of the power electronics. At a first portion of the heat pipe, at least some of a working agent is in the liquid phase and, at a second portion of the heat pipe, at least some of the working agent is in the gas phase. In the first portion of the heat pipe, heat from the power electronics is absorbed by evaporating the working agent in the liquid phase. In the second portion of the heat pipe, heat is released to the cooling agent by condensing the working agent in the gas phase.
Public/Granted literature
- US20130271915A1 HEAT DISSIPATION OF POWER ELECTRONICS OF A COOLING UNIT Public/Granted day:2013-10-17
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