Invention Grant
- Patent Title: Electronic component mounting system
- Patent Title (中): 电子元件安装系统
-
Application No.: US14131807Application Date: 2012-08-31
-
Publication No.: US09332684B2Publication Date: 2016-05-03
- Inventor: Daisuke Nagai
- Applicant: Daisuke Nagai
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2011-210370 20110927
- International Application: PCT/JP2012/005532 WO 20120831
- International Announcement: WO2013/046542 WO 20130404
- Main IPC: H05K13/04
- IPC: H05K13/04 ; H05K13/08 ; H05K3/34

Abstract:
A substrate standby unit that is capable of keeping only one substrate 4 on standby in a substrate sorting mechanism 40 that moves the substrate 4 from the print inspection device M2 to the component installation device M4, a memory device 60 that stores a substrate ID on the substrate 4 that is on standby in the substrate standby unit, and a substrate ID management unit 46 that updates the substrate ID that is stored in the memory device 60 accompanying the transfer of the substrate 4 from the print inspection device M2 to the substrate standby unit are included. The substrate ID stored in the memory device 60 and the inspection result data associated with this substrate ID and stored in an inspection result data memory unit 45 are transmitted to the component installation device M4.
Public/Granted literature
- US20140157591A1 ELECTRONIC COMPONENT MOUNTING SYSTEM Public/Granted day:2014-06-12
Information query