Invention Grant
- Patent Title: Intervertebral implant
- Patent Title (中): 椎间植入物
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Application No.: US14470992Application Date: 2014-08-28
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Publication No.: US09333088B2Publication Date: 2016-05-10
- Inventor: Roger Berger , Joern Richter
- Applicant: DePuy Synthes Products, LLC
- Applicant Address: US MA Raynham
- Assignee: DePuy Synthes Products, Inc.
- Current Assignee: DePuy Synthes Products, Inc.
- Current Assignee Address: US MA Raynham
- Agent Raymond N. Scott, Jr.
- Main IPC: A61F2/44
- IPC: A61F2/44 ; A61F2/30

Abstract:
An intervertebral implant includes opposing upper and lower endplates that are configured to engage respective vertebral surfaces in an intervertebral space. The implant carries a plurality of bone fixation spikes that extend out from each endplate. The spikes define a plurality of outer surfaces that extend from a base to a tip. The spikes are laterally staggered, and have a height that increases along a longitudinal direction from the front toward the rear of the implant, and a define recess formed in at least one outer surfaces.
Public/Granted literature
- US20140371857A1 INTERVERTEBRAL IMPLANT Public/Granted day:2014-12-18
Information query
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