A sorption-based, adhesive contact apparatus and method for contact cooling a patient via conductive thermal exchange are described. The apparatus includes a pad, having a fluid containing layer and adhesive contact surface, and a sorption-based device, fluidly interconnectable to the fluid containing layer, for vaporizing fluid contained in the fluid containing layer and for sorping the vaporized fluid. The fluid vaporization and the vapor sorption cools the adhesive contact surface of the pad. A port control member may selectively establish fluid interconnection between the fluid containing layer and sorption-based device. An internal pressure of the sorption-based device may be established lower than an internal pressure of the fluid-containing layer prior to fluid interconnection therebetween. A fluid retention member and path defining members may be included to facilitate vaporization, vapor diffusion and vapor sorption, thereby enhancing uniform cooling.