Invention Grant
- Patent Title: Apparatus for manufacturing polishing pad and method of manufacturing polishing pad using the same
- Patent Title (中): 用于制造抛光垫的装置及使用其制造抛光垫的方法
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Application No.: US14301823Application Date: 2014-06-11
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Publication No.: US09333467B2Publication Date: 2016-05-10
- Inventor: Youngjun Jang , Bong-Su Ahn , Jin-Su Jeong , Jungsik Choi
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2013-0067218 20130612
- Main IPC: F26B21/06
- IPC: F26B21/06 ; B01F7/00 ; B29B7/40 ; B24B37/24 ; B24D18/00 ; B01F15/06
Abstract:
An apparatus for manufacturing a polishing pad includes a housing including a body, an interconnection portion, and a discharging portion, and a stirrer located in the housing, the stirrer mixing a polishing pad composition and a pore forming material with each other. A diameter of the discharging portion is in a range of about 9 mm to about 16 mm.
Public/Granted literature
- US20140366396A1 APPARATUS FOR MANUFACTURING POLISHING PAD AND METHOD OF MANUFACTURING POLISHING PAD USING THE SAME Public/Granted day:2014-12-18
Information query
IPC分类:
