A method for simultaneously cutting a multiplicity of wafers from a cylindrical workpiece having an axis and a notch applied parallel to the axis in a lateral surface of the workpiece includes applying a cut-in beam on the workpiece where the cut-in beam has a head end and a foot end. The head end is inserted into the notch of the workpiece. The workpiece is held with a feed device so as to position an axis of the work piece parallel to the axes of cylindrical wire guide rollers of a wire saw. The cut-in beam is moved through a planar wire web, where the planar wire web has sections of wire arranged parallel to one another and perpendicular to the axes of the wire guide roller. The wire sections are moved the longitudinal wire direction in the presence of abrasives.