Invention Grant
- Patent Title: Method and machine for cutting thermoformed packages
- Patent Title (中): 切割热成型包装的方法和机器
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Application No.: US13560518Application Date: 2012-07-27
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Publication No.: US09334074B2Publication Date: 2016-05-10
- Inventor: Guido Spix
- Applicant: Guido Spix
- Applicant Address: DE Wolfertschwenden
- Assignee: MULTIVAC SEPP HAGGENMUELLER SE & CO. KG
- Current Assignee: MULTIVAC SEPP HAGGENMUELLER SE & CO. KG
- Current Assignee Address: DE Wolfertschwenden
- Agency: Husch Blackwell LLP
- Priority: DE102011108939 20110729
- Main IPC: B65B57/02
- IPC: B65B57/02 ; B65B61/06 ; B65B65/00 ; B65B9/04 ; B65B41/18 ; B65B47/00
Abstract:
A method is provided for cutting packages out of a composite film in a thermoform packaging machine by previously detecting the position of the sealed seams and by suitably adapting the position of a cutting pattern. Additionally, a thermoform packaging machine is provided for executing the above-mentioned method.
Public/Granted literature
- US20130025243A1 METHOD FOR CUTTING PACKAGES Public/Granted day:2013-01-31
Information query
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