Invention Grant
US09334127B2 Systems, apparatus and methods for transporting substrates in electronic device manufacturing
有权
用于在电子设备制造中传送基板的系统,设备和方法
- Patent Title: Systems, apparatus and methods for transporting substrates in electronic device manufacturing
- Patent Title (中): 用于在电子设备制造中传送基板的系统,设备和方法
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Application No.: US14301382Application Date: 2014-06-11
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Publication No.: US09334127B2Publication Date: 2016-05-10
- Inventor: Izya Kremerman , Jeffrey C. Hudgens
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Dugan & Dugan, PC
- Main IPC: H01L21/677
- IPC: H01L21/677 ; B65G47/90 ; B25J9/04 ; B25J18/00

Abstract:
An electronic device processing system is disclosed. The system includes a transfer chamber including facets and a plurality of single-entry process chambers coupled to the facets, wherein at least some process chambers are non-focalized process chambers, at least one load lock chamber, and a robot apparatus operable to transport substrates between the process chambers and the load lock chamber(s). Robot apparatus includes an upper arm, a forearm, and a wrist member adapted for independent rotation relative to the forearm about a wrist axis, and an end effector adapted to carry a substrate. Various degrees of yaw may be imparted to the wrist member in order to service the non-focalized process chambers. Systems and methods are also provided as are other aspects.
Public/Granted literature
- US20140286736A1 SYSTEMS, APPARATUS AND METHODS FOR TRANSPORTING SUBSTRATES IN ELECTRONIC DEVICE MANUFACTURING Public/Granted day:2014-09-25
Information query
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