Invention Grant
US09334153B1 MEMS device connected to a substrate by flexible support structures
有权
MEMS器件通过柔性支撑结构连接到基板
- Patent Title: MEMS device connected to a substrate by flexible support structures
- Patent Title (中): MEMS器件通过柔性支撑结构连接到基板
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Application No.: US14531861Application Date: 2014-11-03
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Publication No.: US09334153B1Publication Date: 2016-05-10
- Inventor: Raviv Perahia , Hung Nguyen , Richard J. Joyce
- Applicant: HRL LABORATORIES LLC
- Applicant Address: US CA Malibu
- Assignee: HRL Laboratories, LLC
- Current Assignee: HRL Laboratories, LLC
- Current Assignee Address: US CA Malibu
- Agency: Ladas & Parry
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B81C1/00
Abstract:
A MEMS assembly comprising a substrate and a MEMS device; wherein the MEMS device is connected to the substrate by at least two flexible support structures made in a conductive layer formed on a first portion of one of the substrate and the MEMS.
Public/Granted literature
- US3230376A Electro-optical radiant energy detecting apparatus for determining its line of sight Public/Granted day:1966-01-18
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