Invention Grant
- Patent Title: Polyamide resin moldings
- Patent Title (中): 聚酰胺树脂成型品
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Application No.: US13822152Application Date: 2011-09-29
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Publication No.: US09334365B2Publication Date: 2016-05-10
- Inventor: Jun Mitadera , Masashi Kurokawa , Takahiro Takano
- Applicant: Jun Mitadera , Masashi Kurokawa , Takahiro Takano
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Gas Chemical Company, Inc.
- Current Assignee: Mitsubishi Gas Chemical Company, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-228509 20101008
- International Application: PCT/JP2011/072396 WO 20110929
- International Announcement: WO2012/046629 WO 20120412
- Main IPC: C08G69/08
- IPC: C08G69/08 ; C08G69/26 ; C08G69/06 ; C08L77/10 ; C08G18/60 ; C08L77/06 ; C08K5/29

Abstract:
Provided is a xylylenesebacamide resin molding which is excellent in mechanical strength such as elastic modulus and avoids the problem of mechanical strength loss during long-term use. This is a molding of a polyamide resin or a polyamide resin composition containing the polyamide resin, wherein 70 mol % or more of the diamine structural unit is derived from xylylenediamine (A) and 50 mol % or more of the dicarboxylic acid structural unit is derived from sebacic acid (B), and the molding has a crystallinity index of 0 to 50% and a moisture content of 0.1 to 2% by mass.
Public/Granted literature
- US20130172460A1 POLYAMIDE RESIN MOLDINGS Public/Granted day:2013-07-04
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