Invention Grant
US09334424B2 Temporary adhesive for wafer processing, member for wafer processing using the same, wafer processed body, and method for producing thin wafer
有权
用于晶片加工的临时粘合剂，使用其的晶片加工部件，晶片加工体以及薄晶片的制造方法
- Patent Title: Temporary adhesive for wafer processing, member for wafer processing using the same, wafer processed body, and method for producing thin wafer
- Patent Title (中): 用于晶片加工的临时粘合剂，使用其的晶片加工部件，晶片加工体以及薄晶片的制造方法
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Application No.: US13868622Application Date: 2013-04-23
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Publication No.: US09334424B2Publication Date: 2016-05-10
- Inventor: Masahito Tanabe , Michihiro Sugo , Shohei Tagami , Hiroyuki Yasuda , Hideto Kato
- Applicant: SHIN-ETSU CHEMICAL CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2012-106926 20120508
- Main IPC: B32B25/20
- IPC: B32B25/20 ; C09J7/02 ; B32B7/06 ; B32B7/12 ; B32B27/28 ; H01L21/683
Abstract:
The present invention provided is the temporary adhesive for wafer processing which temporarily bonds a wafer having a circuit face on the front surface and a processing face on the back surface to a support, and includes a first temporary adhesive layer which is a layer (A) of a thermoplastic resin modified organopolysiloxane obtained by partial dehydration condensation of an organopolysiloxane resin containing a R21R22R23SiO1/2, and a SiO4/2 unit in a molar ratio of R21R22R23SiO1/2 unit/SiO4/2 unit of 0.6 to 1.7 and an organopolysiloxane represented by the following general formula (1), and a second temporary adhesive layer which is a thermosetting modified siloxane polymer layer (B) which is laminated on the first temporary adhesive layer and is releasably bonded to the support.
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