Invention Grant
US09334425B2 Removable adhesive label containing high tensile modulus polymeric film layer
有权
含有高拉伸模量聚合物膜层的可拆卸粘合标签
- Patent Title: Removable adhesive label containing high tensile modulus polymeric film layer
- Patent Title (中): 含有高拉伸模量聚合物膜层的可拆卸粘合标签
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Application No.: US13262416Application Date: 2010-03-30
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Publication No.: US09334425B2Publication Date: 2016-05-10
- Inventor: Kevin O. Henderson
- Applicant: Kevin O. Henderson
- Applicant Address: US CA Glendale
- Assignee: Avery Dennison Corporation
- Current Assignee: Avery Dennison Corporation
- Current Assignee Address: US CA Glendale
- Agency: Avery Dennison Corporation
- International Application: PCT/US2010/029169 WO 20100330
- International Announcement: WO2010/117767 WO 20101014
- Main IPC: C09J7/02
- IPC: C09J7/02 ; B32B7/12 ; B32B3/10 ; B32B1/02 ; B32B43/00 ; B32B33/00 ; B32B27/08 ; G09F3/10 ; B32B7/02 ; B32B27/10 ; B32B27/18 ; B32B27/20 ; B32B27/28 ; B32B27/30 ; B32B27/32 ; B32B27/34 ; B32B27/36 ; B32B27/40
Abstract:
An adhesive label includes a polymeric first film layer that has a high tensile modulus. The label is useful in various labeling applications and especially in adhesive labeling of reusable and recyclable containers which require removal of the label during a washing process in a warm or hot washing fluid.
Public/Granted literature
- US20130008613A1 Removable Adhesive Label Containing High Tensile Modulus Polymeric Film Layer Public/Granted day:2013-01-10
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