Invention Grant
- Patent Title: Underfill sealant composition
- Patent Title (中): 底部填充密封胶组成
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Application No.: US14200871Application Date: 2014-03-07
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Publication No.: US09334429B2Publication Date: 2016-05-10
- Inventor: Yusuke Horiguchi , Mieko Sano , Kenichiro Sato
- Applicant: HENKEL AG & CO. KGAA
- Applicant Address: DE Duesseldorf
- Assignee: Henkel AG & Co. KGaA
- Current Assignee: Henkel AG & Co. KGaA
- Current Assignee Address: DE Duesseldorf
- Agent Steven C. Bauman
- Main IPC: C09J133/14
- IPC: C09J133/14 ; H01L21/56 ; H01L23/00 ; H01L23/29 ; C09D4/06 ; C09D135/00
Abstract:
The present invention provides a composition which does not cause the problem of use at high temperature in the mounting process of electronic device. The present invention relates to an underfill sealant composition comprising (a) a (meth)acrylic compound and (c) an isocyanuric acid having an allyl group.
Public/Granted literature
- US20140187729A1 UNDERFILL SEALANT COMPOSITION Public/Granted day:2014-07-03
Information query
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