Invention Grant
- Patent Title: Thermal cracker device
- Patent Title (中): 热裂解装置
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Application No.: US13909317Application Date: 2013-06-04
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Publication No.: US09334446B2Publication Date: 2016-05-10
- Inventor: Li-Feng Cheng , Hsien-Cheng Yu , Wen Chun Kuo
- Applicant: E-Sunscience Co., Ltd.
- Applicant Address: TW Taipei
- Assignee: E-Sunscience Co., Ltd.
- Current Assignee: E-Sunscience Co., Ltd.
- Current Assignee Address: TW Taipei
- Agent Leong C. Lei
- Main IPC: C10B1/04
- IPC: C10B1/04 ; C10B21/20 ; C10B47/06 ; C10B53/00
Abstract:
A thermal cracker device includes an outer furnace and a thermal cracking furnace accommodated in the outer furnace. The outer surface of the thermal cracking furnace and the inner surface of the outer furnace define a space. The outer surface of the thermal cracking furnace has a fin structure to define an air flow channel in the space.
Public/Granted literature
- US20130319843A1 THERMAL CRACKER DEVICE Public/Granted day:2013-12-05
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