Invention Grant
- Patent Title: Direct cooled rotary sputtering target
- Patent Title (中): 直接冷却旋转溅射靶
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Application No.: US13757000Application Date: 2013-02-01
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Publication No.: US09334563B2Publication Date: 2016-05-10
- Inventor: George Michael Wityak , Luther Wilburn Cox
- Applicant: Materion Advanced Materials Technologies and Services Inc.
- Applicant Address: US OH Mayfield Heights
- Assignee: Materion Corporation
- Current Assignee: Materion Corporation
- Current Assignee Address: US OH Mayfield Heights
- Agency: Fay Sharpe LLP
- Agent Richard M. Klein
- Main IPC: C23C14/34
- IPC: C23C14/34 ; B23K37/04 ; H01J37/34

Abstract:
A rotary deposition target bonded to a backing tube such that the bonding material is applied only at the ends of the rotary target to form a gap between the rotary target and the backing tube to enable a target cooling fluid used during the deposition process to contact the target directly and to provide a hermetic seal to contain the cooling fluid within the gap and prevent the fluid from being exposed to the environment within the deposition chamber.
Public/Granted literature
- US20130192981A1 DIRECT COOLED ROTARY SPUTTERING TARGET Public/Granted day:2013-08-01
Information query
IPC分类: