Invention Grant
US09334563B2 Direct cooled rotary sputtering target 有权
直接冷却旋转溅射靶

Direct cooled rotary sputtering target
Abstract:
A rotary deposition target bonded to a backing tube such that the bonding material is applied only at the ends of the rotary target to form a gap between the rotary target and the backing tube to enable a target cooling fluid used during the deposition process to contact the target directly and to provide a hermetic seal to contain the cooling fluid within the gap and prevent the fluid from being exposed to the environment within the deposition chamber.
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