Invention Grant
- Patent Title: Fluid-filled vibration damping device
- Patent Title (中): 流体填充减振装置
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Application No.: US14541804Application Date: 2014-11-14
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Publication No.: US09334922B2Publication Date: 2016-05-10
- Inventor: Kei Okumura
- Applicant: SUMITOMO RIKO COMPANY LIMITED
- Applicant Address: JP Komaki
- Assignee: SUMITOMO RIKO COMPANY LIMITED
- Current Assignee: SUMITOMO RIKO COMPANY LIMITED
- Current Assignee Address: JP Komaki
- Agency: Oliff PLC
- Priority: JP2012-160619 20120719
- Main IPC: F16F13/10
- IPC: F16F13/10 ; F16F13/08

Abstract:
A fluid-filled vibration damping device including: a pressure-receiving chamber; an equilibrium chamber; a partition member having a communication aperture through which the two chambers communicate; and an elastic rubber plate superposed to cover the communication aperture from a pressure-receiving chamber side. The elastic rubber plate includes one or more contact retaining portions that are provided on an outer peripheral edge thereof and retained in contact against the partition member, and a deformation-allowing region that is provided between circumferentially opposite ends of one or two of the contact retaining portions of the elastic rubber plate and that is elastically deformable based on pressure differential between the two chambers. A gap is formed between the deformation-allowing region and the partition member so that a communication passage is constituted by including the gap through which the two chambers communicate with each other.
Public/Granted literature
- US20150069686A1 FLUID-FILLED VIBRATION DAMPING DEVICE Public/Granted day:2015-03-12
Information query
IPC分类: