A heat dissipating housing for a lighting device includes a back wall comprising an upper section and a lower section. The housing further includes a sidewall extending down from the upper section of the back wall. The back wall and the sidewall define a cavity of the housing. The upper section of the back wall is elevated from the lower section of the back wall such that when a printed circuit board (PCB) is in contact with the lower section of the back wall within the cavity, an uninsulated electrical element on a back side of the PCB is separated by an air gap from a closest point on the housing by a distance that is at least 0.063 inch. The back side of the PCB faces the upper section of the back wall.