Invention Grant
- Patent Title: Cooler for computing modules of a computer
- Patent Title (中): 用于计算机模块的冷却器
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Application No.: US14238939Application Date: 2013-02-07
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Publication No.: US09335800B2Publication Date: 2016-05-10
- Inventor: Egor A Druzhinin , Andrey A. Mihasev , Alexey B. Shmelev
- Applicant: ZAO “RSC Technologies”
- Applicant Address: RU Moscow
- Assignee: ZAO “RSC Technologies”
- Current Assignee: ZAO “RSC Technologies”
- Current Assignee Address: RU Moscow
- Agency: Inventa Capital PLC
- Priority: RU2012145747 20121026
- International Application: PCT/RU2013/000087 WO 20130207
- International Announcement: WO2014/065696 WO 20140501
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K5/00 ; H05K7/20

Abstract:
The present invention describes a cooling unit for a central processing unit (the CPU) that comprises two flat grooved plates fastened together that jointly form at least one channel that is sealed by hermetic insert blocks wherein the cooling liquid circulates. These plates have heat-dissipating properties for heat-generating electronic components of the CPU contacting with them, while the channel in which the cooling liquid circulates has an inlet and an outlet, to supply and discharge the cooling liquid, respectively. The technical result of the proposed technical solution is to increase the effectiveness and efficiency of a cooling system for the CPU, simplify its design, improve reliability characteristics, and reduce energy consumption of the cooling system.
Public/Granted literature
- US20150234438A1 Cooler for Computing modules of a Computer Public/Granted day:2015-08-20
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