Invention Grant
- Patent Title: Electronic pad
- Patent Title (中): 电子垫
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Application No.: US14753035Application Date: 2015-06-29
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Publication No.: US09336759B2Publication Date: 2016-05-10
- Inventor: Yoshiaki Mori
- Applicant: ROLAND CORPORATION
- Applicant Address: JP Shizuoka
- Assignee: ROLAND CORPORATION
- Current Assignee: ROLAND CORPORATION
- Current Assignee Address: JP Shizuoka
- Agency: Jianq Chyun IP Office
- Priority: JP2014-146332 20140716
- Main IPC: G10D13/02
- IPC: G10D13/02 ; G10D13/06 ; G10H1/00 ; G10H1/32 ; G10H3/14

Abstract:
The present invention provides an electronic pad, including: a struck body, including a first struck portion and a second struck portion; a first and a second vibration sensor, detecting a vibration of the first struck portion and the second struck portion. In the electronic pad, a partitioning portion is interposed between the first struck portion and the second struck portion for partitioning. The partitioning portion includes: a first upright portion, protruding further than at least one of an upper surface of the first struck portion and a lower surface opposite the upper surface; a second upright portion, separated from the first upright portion by a predetermined spacing and protruding further than at least one of an upper surface of the second struck portion and a lower surface opposite the upper surface; and a connection portion connected between the first upright portion and the second upright portion.
Public/Granted literature
- US20160019873A1 ELECTRONIC PAD Public/Granted day:2016-01-21
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