Invention Grant
- Patent Title: Semiconductor memory device including stacked memory chips
- Patent Title (中): 半导体存储器件包括堆叠的存储器芯片
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Application No.: US14535075Application Date: 2014-11-06
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Publication No.: US09336857B2Publication Date: 2016-05-10
- Inventor: Min-Su Park , Young-Jun Ku
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP&T Group LLP
- Priority: KR10-2014-0048311 20140422
- Main IPC: G11C11/4093
- IPC: G11C11/4093 ; G11C7/10

Abstract:
A semiconductor memory device includes: a master chip suitable for generating a plurality of first control signals and a second control signal based on a read command; and a plurality of slave chips each suitable for latching data read from a plurality of memory cells included in a corresponding slave chip and transmitting the latched data to the master chip based on a correspond control signal of the first control signals, wherein the master chip latches the data transmitted from the slave chips based on the first control signals and outputs the data latched in the master chip based on the second control signal.
Public/Granted literature
- US20150302915A1 SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2015-10-22
Information query
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