Invention Grant
- Patent Title: Tantalum capacitor and method of manufacturing the same
- Patent Title (中): 钽电容器及其制造方法
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Application No.: US14212889Application Date: 2014-03-14
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Publication No.: US09336956B2Publication Date: 2016-05-10
- Inventor: Jae Bum Cho , Kyoung Sup Choi , Hong Kyu Shin , Jeong Oh Hong , Wan Suk Yang , Hyun Sub Oh
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0131108 20131031
- Main IPC: H01G9/042
- IPC: H01G9/042 ; H01G9/15 ; H01G9/04 ; B23K26/36 ; B23K26/00 ; H01G9/012 ; H01G9/08
Abstract:
A tantalum capacitor includes a capacitor body containing tantalum powder and having a tantalum wire extending downwardly; a molded part enclosing the capacitor body and exposing an end portion of the tantalum wire; a positive electrode lead frame disposed on a lower surface of the molded part and connected to the end portion of the tantalum wire; a negative electrode lead frame disposed on the lower surface of the molded part; and a conductive adhesive layer disposed between the capacitor body and the negative electrode lead frame.
Public/Granted literature
- US20150116910A1 TANTALUM CAPACITOR AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-04-30
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