Invention Grant
- Patent Title: Semiconductor device and method of making semiconductor device
- Patent Title (中): 半导体器件及制造半导体器件的方法
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Application No.: US11856086Application Date: 2007-09-17
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Publication No.: US09337047B2Publication Date: 2016-05-10
- Inventor: Danny Pak-Chum Shum , Ronald Kakoschke , John Power , Wolfram Langheinrich
- Applicant: Danny Pak-Chum Shum , Ronald Kakoschke , John Power , Wolfram Langheinrich
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/788
- IPC: H01L29/788 ; H01L21/4763 ; H01L21/28 ; H01L27/105 ; H01L27/115 ; H01L29/66 ; H01L29/78

Abstract:
One or more embodiments are related to a semiconductor device, comprising: a high-K dielectric material; and a nitrogen-doped silicon material disposed over said high-k dielectric material.
Public/Granted literature
- US20090072292A1 SEMICONDUCTOR DEVICE AND METHOD OF MAKING SEMICONDUCTOR DEVICE Public/Granted day:2009-03-19
Information query
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