Invention Grant
- Patent Title: Method for reducing nonuniformity of forward voltage of semiconductor wafer
- Patent Title (中): 降低半导体晶片正向电压不均匀的方法
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Application No.: US14769011Application Date: 2013-03-06
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Publication No.: US09337058B2Publication Date: 2016-05-10
- Inventor: Shinya Iwasaki
- Applicant: Shinya Iwasaki
- Applicant Address: JP Toyota
- Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee Address: JP Toyota
- Agency: Oliff PLC
- International Application: PCT/JP2013/056112 WO 20130306
- International Announcement: WO2014/136215 WO 20140912
- Main IPC: H01L21/26
- IPC: H01L21/26 ; H01L21/42 ; H01L21/322 ; H01L29/36 ; H01L29/66 ; H01L21/263 ; H01L21/265 ; H01L29/32

Abstract:
There is provided a method for reducing the nonuniformity of forward voltage Vf of an N-type semiconductor wafer in which density of impurities included in an N-layer is nonuniformly distributed in a plane view of the semiconductor wafer. The method reduces the nonuniformity of forward voltage, by irradiating charged particles to the N-type semiconductor wafer, and generating defects in the N-layer to reduce the nonuniformity of forward voltage. In one aspect of the method, charged particles are irradiated so that a reaching positon in a depth direction or an irradiation density may differ according to the density of impurities in the N-layer in the plane view of the semiconductor wafer.
Public/Granted literature
- US20160005622A1 METHOD FOR REDUCING NONUNIFORMITY OF FORWARD VOLTAGE OF SEMICONDUCTOR WAFER Public/Granted day:2016-01-07
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