A particle level varied depending on a drying processing condition can be suppressed to be stably lowered. A batch type substrate processing apparatus include a cleaning processing unit 62 having a cleaning tank 69 that stores therein a cleaning solution for cleaning a substrate, and a drying processing unit 61 disposed above the cleaning tank 69 and having a drying chamber 65 configured to perform therein a drying process on the substrate. Based on a previously investigated relationship, an internal temperature of the drying chamber is set as an internal temperature of the drying chamber when loading the substrate thereinto corresponding to the batch size of a next batch process performed in the drying chamber, and the internal temperature of the drying chamber is adjusted to be identical to the set internal temperature of the drying chamber before loading the substrate into the drying chamber.