Invention Grant
- Patent Title: MOL resistor with metal grid heat shield
- Patent Title (中): MOL电阻与金属网格隔热罩
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Application No.: US14302757Application Date: 2014-06-12
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Publication No.: US09337088B2Publication Date: 2016-05-10
- Inventor: William F. Clark, Jr. , Robert R. Robison , Hung H. Tran
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Hoffman Warnick LLC
- Agent Steven J. Meyers
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L49/02 ; H01L23/367 ; H01L23/522
Abstract:
An semiconductor structure, method of fabrication therefor, and design structure therefor is provided. A thermal grid is formed over at least a portion of a substrate. An insulating layer is formed over at least a portion of the thermal grid. A resistor is formed over at least a portion of the insulating layer. A buried interconnect is connected to the thermal grid via at least one contact. The buried interconnect is adapted to receive thermal energy from the thermal grid via the at least one contact.
Public/Granted literature
- US20150364398A1 MOL RESISTOR WITH METAL GRID HEAT SHIELD Public/Granted day:2015-12-17
Information query
IPC分类:
