Invention Grant
- Patent Title: Leadframe strip and leadframes
- Patent Title (中): 引线框和引线框架
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Application No.: US14444516Application Date: 2014-07-28
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Publication No.: US09337130B2Publication Date: 2016-05-10
- Inventor: Wen Yu Lee , Steven Su
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48

Abstract:
A leadframe strip including a first leadframe having a first die pad and a first plurality of generally parallel leads each extending outwardly relative to the first die pad and terminating in a free end and a second leadframe having a second die pad and a second plurality of generally parallel leads extending outwardly relative to the second die pad and terminating in a free end. The free ends of the second plurality of leads are positioned in close nontouching adjacent relationship with the free ends of the first plurality of leads. The two leadframes may be separated from each other by a single saw cut.
Public/Granted literature
- US20160027721A1 Leadframe Strip And Leadframes Public/Granted day:2016-01-28
Information query
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