Methods and systems for solder shielding of ball grid arrays are disclosed and may include placing an array of solder balls onto a substrate, where the substrate may comprise a contact pad for each of the solder balls and a subset of the contact pads may be coupled via a solder mask opening. A subset of the array of solder balls may be coupled utilizing a solder reflow process and via the solder mask opening. The coupled subset may comprise an outer perimeter of the array. The substrate may comprise an interposer or an integrated circuit die, where the coupled subset shields circuitry from receiving electromagnetic interference. The substrate may comprise a packaging substrate or a printed circuit board (PCB) and the coupled subset may be coupled to a ground plane. The subset of the array of solder balls may be utilized to generate one or more reactive elements.