Invention Grant
US09337152B2 Formulation for packaging an electronic device and assemblies made therefrom
有权
用于包装由其制成的电子设备和组件的配方
- Patent Title: Formulation for packaging an electronic device and assemblies made therefrom
- Patent Title (中): 用于包装由其制成的电子设备和组件的配方
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Application No.: US13843505Application Date: 2013-03-15
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Publication No.: US09337152B2Publication Date: 2016-05-10
- Inventor: David William Sherrer , James D MacDonald
- Applicant: Nuvotronics, LLC
- Applicant Address: US VA Radford
- Assignee: Nuvotronics, Inc
- Current Assignee: Nuvotronics, Inc
- Current Assignee Address: US VA Radford
- Agency: Dann, Dorfman, Herrell and Skillman, P.C.
- Agent Niels Haun
- Main IPC: B32B18/00
- IPC: B32B18/00 ; H01L23/29 ; H01L23/552 ; H05K5/00 ; H05K9/00 ; H01L23/31 ; H01L23/66 ; H01L23/24 ; H01L23/00
Abstract:
Disclosed and claimed herein is a formulation for packaging an electronic device and assemblies made therefrom.
Public/Granted literature
- US20140268625A1 Formulation for Packaging an Electronic Device and Assemblies Made Therefrom Public/Granted day:2014-09-18
Information query
