Invention Grant
- Patent Title: Method for manufacturing a fan-out WLP with package
- Patent Title (中): 用于制造具有封装的扇出WLP的方法
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Application No.: US14525462Application Date: 2014-10-28
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Publication No.: US09337165B2Publication Date: 2016-05-10
- Inventor: Hiroaki Sato , Kiyoaki Hashimoto , Yoshikuni Nakadaira , Norihito Masuda , Belgacem Haba , Ilyas Mohammed , Philip Damberg
- Applicant: Tessera, Inc.
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/00 ; H01L21/56 ; H01L23/13 ; H01L23/31 ; H01L23/498
Abstract:
The present disclosure is directed to a method for making a microelectronic package that includes assembling a microelectronic unit with a substrate, and electrically connecting redistribution contacts on the microelectronic unit and terminals on the substrate with a conductive matrix material extending within at least one opening extending through the substrate.
Public/Granted literature
- US20150044824A1 Fan-Out WLP With Package Public/Granted day:2015-02-12
Information query
IPC分类:
