Invention Grant
- Patent Title: Butted contact shape to improve SRAM leakage current
- Patent Title (中): 对接接触形状,提高SRAM漏电流
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Application No.: US14662326Application Date: 2015-03-19
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Publication No.: US09337205B2Publication Date: 2016-05-10
- Inventor: Tzyh-Cheang Lee
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eshweiler & Associates, LLC
- Main IPC: H01L27/11
- IPC: H01L27/11 ; H01L21/768 ; H01L23/485

Abstract:
The present disclosure relates to an SRAM memory cell. The SRAM memory cell has a semiconductor substrate with an active area and a gate region positioned above the active area. A butted contact extends from a position above the active area to a position above the gate region. The butted contact contains a plurality of distinct regions having different widths (i.e., the smaller dimensions of the butted contact), such that a region spanning the active area and gate region has width less than the regions in contact with the active area or gate region. By making the width of the region spanning the active area and gate region smaller than the regions in contact with the active area or gate, the etch rate is reduced at a junction of the gate region with the active area, thereby preventing etch back of the gate material and leakage current.
Public/Granted literature
- US20150194432A1 BUTTED CONTACT SHAPE TO IMPROVE SRAM LEAKAGE CURRENT Public/Granted day:2015-07-09
Information query
IPC分类: