Invention Grant
- Patent Title: Semiconductor device and method of manufacturing semiconductor device
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13846180Application Date: 2013-03-18
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Publication No.: US09337256B2Publication Date: 2016-05-10
- Inventor: Naoki Izumi
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2007-251828 20070927; JP2007-255650 20070928; JP2008-228501 20080905
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/761 ; H01L21/8234 ; H01L27/092 ; H01L29/66 ; H01L21/8238 ; H01L29/423

Abstract:
A method of manufacturing a semiconductor device having a VDMOSFET (Vertical Double-diffused Metal Oxide Semiconductor Field-Effect Transistor) and a planar gate MOSFET (Metal Oxide Semiconductor Field-Effect Transistor), including forming a semiconductor layer of a first conductivity type by epitaxy, forming a body region recess for forming a body region of the VDMOSFET on the semiconductor layer, and embedding a semiconductor material of a second conductivity type in the body region recess by epitaxy or CVD (Chemical Vapor Deposition).
Public/Granted literature
- US20130214351A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2013-08-22
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