Invention Grant
- Patent Title: Conductive composition and conductive feature formed at low temperatures
- Patent Title (中): 在低温下形成的导电组成和导电特性
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Application No.: US13877824Application Date: 2011-10-07
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Publication No.: US09337362B2Publication Date: 2016-05-10
- Inventor: Chun Christine Dong
- Applicant: Chun Christine Dong
- Applicant Address: US PA Allentown
- Assignee: Air Products and Chemicals, Inc.
- Current Assignee: Air Products and Chemicals, Inc.
- Current Assignee Address: US PA Allentown
- Agent Amy Carr-Trexler
- International Application: PCT/US2011/055371 WO 20111007
- International Announcement: WO2012/054244 WO 20120426
- Main IPC: H01L31/0224
- IPC: H01L31/0224 ; H01B1/22 ; C08K5/41 ; C08K3/08 ; C08K5/053
Abstract:
A method for forming a conductive feature. The method includes providing a substrate and providing a conductive composition. The conductive composition includes metal particles, a non-acid protic solvent, and a high polarity solvent. The non-acid protic solvent and high polarity solvent are present in concentrations sufficient to ionize the non-acid protic solvent and remove oxides when heated. The method further includes heating the composition to a temperature less than about 250° C. to form a conductive feature having less than about ten times the resistivity of bulk copper.
Public/Granted literature
- US20130252372A1 CONDUCTIVE COMPOSITION AND CONDUCTIVE FEATURE FORMED AT LOW TEMPERATURES Public/Granted day:2013-09-26
Information query
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