Invention Grant
- Patent Title: Light emitting device package
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Application No.: US14691527Application Date: 2015-04-20
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Publication No.: US09337386B2Publication Date: 2016-05-10
- Inventor: Sung-uk Zhang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRIC CO., LTD.
- Current Assignee: SAMSUNG ELECTRIC CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0153707 20121226
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/20 ; H01L33/60 ; H01L33/54 ; H01L33/52 ; H01L33/62
Abstract:
A light emitting device package is provided. The light emitting device includes: a substrate; a light emitting device disposed at one side of the substrate; and a formation layer formed on the substrate and having a slope at an edge portion of the formation layer.
Public/Granted literature
- US20150228852A1 LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2015-08-13
Information query
IPC分类:
