Invention Grant
- Patent Title: Light emitting device package
- Patent Title (中): 发光装置封装
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Application No.: US13366945Application Date: 2012-02-06
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Publication No.: US09337401B2Publication Date: 2016-05-10
- Inventor: Sangyoul Lee
- Applicant: Sangyoul Lee
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Ked & Associates, LLP
- Priority: KR10-2011-0050074 20110526
- Main IPC: F21V3/00
- IPC: F21V3/00 ; F21V5/00 ; H01L33/56 ; H01L33/50
Abstract:
A light emitting device package according to one exemplary embodiment includes a sealing material and organic particles. The organic particles enhance a heat discharge rate and thus reliability of the light emitting device package due to excellent thermal characteristics thereof. Moreover, the organic particles achieve an optical distribution effect to enhance light extraction efficiency of the light emitting device package.
Public/Granted literature
- US20120134137A1 LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2012-05-31
Information query
