Invention Grant
- Patent Title: Thermoelectric conversion module
- Patent Title (中): 热电转换模块
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Application No.: US14342115Application Date: 2011-11-22
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Publication No.: US09337409B2Publication Date: 2016-05-10
- Inventor: Takahiro Ochi , Shogo Suzuki , Masaaki Kikuchi , Huiyuan Geng , Satoru Ito , Junqing Guo
- Applicant: Takahiro Ochi , Shogo Suzuki , Masaaki Kikuchi , Huiyuan Geng , Satoru Ito , Junqing Guo
- Applicant Address: JP Tokyo
- Assignee: FURUKAWA CO., LTD.
- Current Assignee: FURUKAWA CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- International Application: PCT/JP2011/006512 WO 20111122
- International Announcement: WO2013/076765 WO 20130530
- Main IPC: H01L35/10
- IPC: H01L35/10 ; H01L35/08

Abstract:
A thermal stress of electrode members (121 to 123) due to an operation temperature may be relaxed by thermal stress relaxation layers (141 to 144), and thus peeling of the electrode members (121 to 123) due to thermal stress at the operation temperature may be prevented in a satisfactory manner. Furthermore, diffusion of a constituent component of the thermoelectric conversion members (111 and 112) due to the operation temperature and the like may be prevented by diffusion prevention layers (151 to 154), and thus durability and stability of the thermoelectric conversion module (100) may be improved.
Public/Granted literature
- US20140216515A1 THERMOELECTRIC CONVERSION MODULE Public/Granted day:2014-08-07
Information query
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