Invention Grant
- Patent Title: Multi layer 3D antenna carrier arrangement for electronic devices
- Patent Title (中): 用于电子设备的多层3D天线载体布置
-
Application No.: US13622134Application Date: 2012-09-18
-
Publication No.: US09337532B2Publication Date: 2016-05-10
- Inventor: Kiran Vanjani , Jorge Fabrega Sanchez , Hui Vicki Tan
- Applicant: Futurewei Technologies, Inc.
- Applicant Address: US TX Plano
- Assignee: Futurewei Technologies, Inc.
- Current Assignee: Futurewei Technologies, Inc.
- Current Assignee Address: US TX Plano
- Agency: Conley Rose, P.C.
- Agent Grant Rodolph; Adam J. Stegge
- Main IPC: H01Q1/12
- IPC: H01Q1/12 ; H01Q1/38 ; H01Q1/24 ; H01Q5/371 ; H01Q9/04
Abstract:
An antenna comprising a plurality of carrier blocks, wherein each carrier block is coupled to at least one other carrier block, and a plurality of radiators, wherein each radiator is connected to at least one carrier block. Further, an antenna comprising a plurality of carrier blocks, wherein each carrier block is coupled with at least one other carrier block, and a radiator connected to at least two of the plurality of carrier blocks.
Public/Granted literature
- US20140078017A1 Multi Layer 3D Antenna Carrier Arrangement for Electronic Devices Public/Granted day:2014-03-20
Information query
