Invention Grant
- Patent Title: Printed circuit board, method of manufacturing the same and connection terminal
- Patent Title (中): 印刷电路板，制造方法和连接端子
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Application No.: US13674323Application Date: 2012-11-12
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Publication No.: US09337559B2Publication Date: 2016-05-10
- Inventor: Yoshito Fujimura , Jun Ishii
- Applicant: Yoshito Fujimura , Jun Ishii
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Priority: JP2012-022233 20120203
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/09 ; H05K1/11 ; H05K7/10 ; H01R12/00 ; H05K3/06 ; H05K1/05 ; G11B5/48
Abstract:
A read wiring trace and a write wiring trace are formed on an insulating layer. Connection terminals made of conductor are connected to the read wiring trace and the write wiring trace, respectively. Each connection terminal has at least one corner with a radius of curvature of not larger than 35 μm.
Public/Granted literature
- US20130203294A1 PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME AND CONNECTION TERMINAL Public/Granted day:2013-08-08
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