Invention Grant
- Patent Title: Packaged RF amplifier devices and methods of manufacture thereof
- Patent Title (中): 封装RF放大器装置及其制造方法
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Application No.: US14491574Application Date: 2014-09-19
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Publication No.: US09337774B2Publication Date: 2016-05-10
- Inventor: Margaret A. Szymanowski , L. M. Mahalingam , Sarmad K. Musa , Fernando A. Santos , Jerry L. White
- Applicant: FREESCALE SEMICONDUCTOR, INC.
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee Address: US TX Austin
- Agent Sherry W. Schumm
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H03F1/02 ; H01L21/56 ; H01L25/065 ; H03F1/42 ; H03F3/19 ; H03F3/21 ; H01L23/64
Abstract:
An embodiment of a packaged radio frequency (RF) device includes a device substrate with a voltage reference plane, a first input lead coupled to the device substrate, a first output lead coupled to the device substrate, a first transistor die coupled to a top surface of the device substrate with a solder bond, a second die coupled to the top surface of the device substrate with a conductive epoxy that electrically couples at least one component of the second die to the voltage reference plane, and non-conductive molding compound over the top surface of the device substrate and encompassing the first transistor die, the second die, a portion of the first input lead, and a portion of the first output lead.
Public/Granted literature
- US20160087586A1 PACKAGED RF AMPLIFIER DEVICES AND METHODS OF MANUFACTURE THEREOF Public/Granted day:2016-03-24
Information query
IPC分类:
